Standard JEDEC IC Tray for LGA Type Essential In Semiconductor Packaging Process
Standard JEDEC IC TRAY Commonly Used In The Manufacturing Process Of The Semiconductor Industry
This JEDEC-compliant matrix tray is tailored for manufacturers who require high-performance handling solutions in precision electronics environments. Made with static-dissipative material, it delivers essential ESD protection while maintaining structural uniformity during repeated handling cycles. Its integrated locating and alignment features support fast and accurate positioning on automated lines, while molded pockets ensure secure device containment throughout testing, assembly, and shipment.
Features & Benefits:
• Standards-Aligned Geometry: Fully conforms to JEDEC outline requirements for compatibility with global processing equipment.
• Reliable Electrostatic Control: Made from conductive materials that provide consistent ESD protection, helping safeguard sensitive components.
• Consistent Part Presentation: Precision-formed cells hold parts securely in fixed orientations, reducing handling errors and device shift.
• Optimized for Robotics: Designed for compatibility with vacuum pickup tools, mechanical arms, and inline feeding systems.
• Structural Resilience: Withstands operational stress during processing and storage while retaining tray flatness and pocket integrity.
• Efficient Storage & Transport: Interlocking edges allow for stable, space-saving stacking, whether in-process or in storage.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN23072 | Cavity Size | 21.18*16.08*2.6mm |
| Package Type | IC Component | Matrix QTY | 13*4=52PCS |
| Material | PPE | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Application:
Engineered for IC assembly, automated inspection, and semiconductor testing, this tray is ideal for operations where speed and handling precision are key. It supports a wide variety of electronics manufacturing scenarios—from chip-level packaging to system module assembly—and integrates easily into both inline and batch-process setups. Whether in a cleanroom or on a standard production floor, the tray ensures reliable positioning and part safety at every stage.
Customization:
The tray’s flexible design supports a wide range of customized configurations to meet specific production challenges:
• Tailored Pocket Layouts: Adjust pocket size, count, or spacing to match non-standard part dimensions or shapes.
• Color Coding Options: Use ESD-safe materials in selected colors for identifying product types, workstations, or production phases.
• In-Mold Marking: Add customer-specific identifiers or tracking features during manufacturing for clear and permanent identification.
• Specialized Alignment Features: Modify edges or add tool-specific indexing tabs to optimize performance in proprietary handling systems.
