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Standard JEDEC IC Tray For LGA Type Essential In Semiconductor Packaging Process

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Standard JEDEC IC Tray For LGA Type Essential In Semiconductor Packaging Process

Brand Name : Hiner-pack

Model Number : HN23072

Place of Origin : China

Certification : ISO 9001 SGS ROHS

MOQ : 1000 pcs

Price : TBC

Packaging Details : 80~100pcs/carton

Delivery Time : 1~2 Weeks

Payment Terms : 100% Prepayment

Supply Ability : 2000PCS/Day

Mold No. : HN23072

Cavity Size/mm : 21.18*16.08*2.6

Overall Size/mm : 322.6x135.9x7.62

Matrix Quantity : 13X4=52PCS

Material : MPPO/PPE

Height : 7.62mm

IC Type : BGA,QFP,QFN,LGA,PGA

Tray Features : Stackable

Tray Shape : Rectangular

Surface Resistance : 1.0*10e4-1.0*10e11Ω

Color : Customer'requirement

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Standard JEDEC IC Tray for LGA Type Essential In Semiconductor Packaging Process

Standard JEDEC IC TRAY Commonly Used In The Manufacturing Process Of The Semiconductor Industry


This JEDEC-compliant matrix tray is tailored for manufacturers who require high-performance handling solutions in precision electronics environments. Made with static-dissipative material, it delivers essential ESD protection while maintaining structural uniformity during repeated handling cycles. Its integrated locating and alignment features support fast and accurate positioning on automated lines, while molded pockets ensure secure device containment throughout testing, assembly, and shipment.

Features & Benefits:

• Standards-Aligned Geometry: Fully conforms to JEDEC outline requirements for compatibility with global processing equipment.

• Reliable Electrostatic Control: Made from conductive materials that provide consistent ESD protection, helping safeguard sensitive components.

• Consistent Part Presentation: Precision-formed cells hold parts securely in fixed orientations, reducing handling errors and device shift.

• Optimized for Robotics: Designed for compatibility with vacuum pickup tools, mechanical arms, and inline feeding systems.

• Structural Resilience: Withstands operational stress during processing and storage while retaining tray flatness and pocket integrity.

• Efficient Storage & Transport: Interlocking edges allow for stable, space-saving stacking, whether in-process or in storage.

Technical Parameters:

Brand Hiner-pack Outline Line Size 322.6*135.9*7.62mm
Model HN23072 Cavity Size 21.18*16.08*2.6mm
Package Type IC Component Matrix QTY 13*4=52PCS
Material PPE Flatness MAX 0.76mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate RoHS




Application:

Engineered for IC assembly, automated inspection, and semiconductor testing, this tray is ideal for operations where speed and handling precision are key. It supports a wide variety of electronics manufacturing scenarios—from chip-level packaging to system module assembly—and integrates easily into both inline and batch-process setups. Whether in a cleanroom or on a standard production floor, the tray ensures reliable positioning and part safety at every stage.

Customization:

The tray’s flexible design supports a wide range of customized configurations to meet specific production challenges:

• Tailored Pocket Layouts: Adjust pocket size, count, or spacing to match non-standard part dimensions or shapes.

• Color Coding Options: Use ESD-safe materials in selected colors for identifying product types, workstations, or production phases.

• In-Mold Marking: Add customer-specific identifiers or tracking features during manufacturing for clear and permanent identification.

• Specialized Alignment Features: Modify edges or add tool-specific indexing tabs to optimize performance in proprietary handling systems.


Product Tags:

JEDEC standard matrix tray

      

Semiconductor Packaging JEDEC IC Tray

      

LGA Type JEDEC IC Tray

      
Wholesale Standard JEDEC IC Tray For LGA Type Essential In Semiconductor Packaging Process from china suppliers

Standard JEDEC IC Tray For LGA Type Essential In Semiconductor Packaging Process Images

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