ESD-Safe Custom Semiconductor JEDEC Tray For IC Assembly And Inspection
Reduce device shift, contamination, and static discharge with JEDEC trays optimized for secure semiconductor handling.
This JEDEC matrix tray is designed to deliver reliable performance in semiconductor and electronics manufacturing settings. Made of durable static-dissipative material, it ensures the safety of delicate components and retains accurate positioning during automated handling and storage procedures.
The tray's standardized characteristics enable seamless compatibility with tray feeders, robotic arms, and inspection systems. Thanks to its robust build and automation-friendly design, this tray contributes to process stability from the point of initial loading all the way through to final packaging.
Features:
JEDEC Standard Compatibility
Seamlessly works with industry-standard automation and handling systems across global production lines.
Permanent ESD Protection
Conductive polymer provides consistent electrostatic discharge protection for sensitive microelectronics.
Accurate Part Alignment
Uniform pocket design and defined edges help maintain component orientation and position throughout transit.
Automation-Ready Elements
Orientation markers, pickup zones, and mechanical indexing features support integration with robotic and mechanical tools.
Stable Stacking Interface
Tray edges interlock for safe and reliable vertical stacking, reducing tray movement during storage or shipment.
Operational Endurance
Built to withstand multiple handling cycles, including mechanical transfers and exposure to temperature-controlled processes.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN24086 | Cavity Size | 6.4*6.4*2.5mm |
| Package Type | IC Component | Matrix QTY | 10*14=140PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Applications:
This tray is versatile and caters to various needs in electronics manufacturing. It can be used for IC packaging, test and burn-in cycles, SMT assembly, and module inspection. The tray is designed to ensure components are safely transported and stored without damage during different stages of the manufacturing process.
Its compatibility with vacuum-based handling systems and tray elevators makes it suitable for use in both inline and batch workflows. This feature is particularly beneficial for facilities that focus on efficiency and the protection of their components.
Customization:
Flexible customization options help meet unique workflow and component requirements:
-
Pocket Profile Adjustment: Tailor cell depth, shape, and layout to accommodate various component sizes, shapes, and fragility levels.
-
Material Color Variants: Choose from multiple static-dissipative colors to simplify line control or distinguish product types.
-
Embedded Molded Identifiers: Integrate tracking codes, lot numbers, or branding directly into the tray mold for durable traceability.
-
Tool Interface Adaptations: Add edge features or locator designs to align with proprietary robotic systems or custom conveyors.
